MaAnt Divine Furnace SL-1 Deicing by Magic Furnace for IC Chip Heating De-gumming and De-tinning Platform

MaAnt SL-1 Deicing by Magic Furnace for IC Chip Heating De-gumming and De-tinning

Features:

One-button heating, rapid heating, the temperature can be adjusted 160-250C, support multi-generation Apple, Huawei chip glue removal, tin removal work

This applies to 99%of the chips on the market, 20mm x 18.5mm working area, supports multiple generations Apple mobile phone chip, Huawei mobile phone chip universal hard disk, and CPU Glue detinning

When heating, the temperature can be adjusted between 160℃ and 250℃, effectively avoid due to high temperatures or improper training Burn-out chip

After opening the glue removal table and heating it to the set temperature, you can use the brush or cotton ball and a cotton swab to remove the residual tin

No tin line, a wipe can easily remove tin and glue, and easy and quick tin planting

Air gun heating is safer than 100 degrees lower than air gun temperature scraping

No soldering iron heating without repeated scraping of a soldering iron, no damage to the pad

After heating to a set temperature, use a cotton swab, which can handle clean residual tin without damage to the pad paint Non-absorbent tin brings back the wipe that wears the chip for a long time

Fast heating, no leakage, no static electricity, safer curve heating, built-in professional adjustment curve, no need to worry, about chip damage caused by thermal stress

According to the needs of the job, set the temperature adjustment to you, the required temperature, one-click Heat up quickly, no need to worry about temperature over the damaged chip

Hidden screw, flexible and light, flexible telescopic clamping at the same time, the hidden screw prevents the residue from falling into the screw and is more, durable and useful

Fast charger support heating work, work want do it right where you are, anytime, anywhere professional